3179 motorola sensor device data www.motorola.com/semiconductors $"$ "##%" # " ! $ !"$%" ! #$ "$ the mpxv5004g series piezoresistive transducer is a stateoftheart monolithic silicon pressure sensor designed for a wide range of applications, but particularly those employing a microcontroller or microprocessor with a/d inputs. this sensor combines a highly sensitive implanted strain gauge with advanced micromachining techniques, thinfilm metallization, and bipolar processing to provide an accurate, high level analog output signal that is proportional to the applied pressure. features ? temperature compensated over 10 to 60 c ? available in gauge surface mount (smt) or through hole (dip) configurations ? durable thermoplastic (pps) package application examples ? washing machine water level ? ideally suited for microprocessor or microcontroller based systems figure 1. fully integrated pressure sensor schematic v s sensing element v out gnd thin film temperature compensation and gain stage #1 gain stage #2 and ground reference shift circuitry pins 1, 5, 6, 7, and 8 are no connects for small outline package device
semiconductor technical data pin number 1 2 3 n/c v s gnd 5 6 7 n/c n/c n/c 4v out 8 n/c
integrated pressure sensor 0 to 3.92 kpa (0 to 400 mm h 2 o) 1.0 to 4.9 v output mpxv5004gc7u case 482c small outline package throughhole mpxv5004g7u case 482b j mpxv5004g6u case 482 mpxv5004gc6u case 482a note: pins 1, 5, 6, 7, and 8 are internal device connections. do not connect to external circuitry or ground. pin 1 is noted by the notch in the lead. small outline package surface mount mpxv5004dp case 1351 mpxv5004gvp case 1368 mpxv5004gp case 1369 rev 5
3180 motorola sensor device data www.motorola.com/semiconductors maximum ratings (note) parametrics symbol value unit maximum pressure (p1 > p2) p max 16 kpa storage temperature t stg 30 to +100 c operating temperature t a 0 to +85 c note: exposure beyond the specified limits may cause permanent damage or degradation to the device. operating characteristics (v s = 5.0 vdc, t a = 25 c unless otherwise noted, p1 > p2. decoupling circuit shown in figure 3 required to meet electrical specifications) characteristic symbol min typ max unit pressure range p op 0 e 3.92 400 kpa mm h 2 o supply voltage (1) v s 4.75 5.0 5.25 vdc supply current i s e e 10 madc span at 306 mm h 2 o (3 kpa) (2) v fss e 3.0 e v offset (3)(5) v off 0.75 1.00 1.25 v sensitivity v/p e 1.0 9.8 e v/kpa mv/mm h 2 o accuracy (4)(5) 0 to 100 mm h 2 o (10 to 60 c) 100 to 400 mm h 2 o (10 to 60 c) e e e 1.5 2.5 %v fss %v fss notes: 1. device is ratiometric within this specified excitation range. 2. span is defined as the algebraic difference between the output voltage at specified pressure and the output voltage at the mi nimum rated pressure. 3. offset (v off ) is defined as the output voltage at the minimum rated pressure. 4. accuracy (error budget) consists of the following: ? linearity: output deviation from a straight line relationship with pressure over the specified pressure range. ? temperature hysteresis: output deviation at any temperature within the operating temperature range, after the temperature is cycled to and from the minimum or maximum operating temperature points, with zero differential pressure applied. ? pressure hysteresis: output deviation at any pressure within the specified range, when this pressure is cycled to and from the minimum or maximum rated pressure, at 25 c. ? offset stability: output deviation, after 1000 temperature cycles, 30 to 100 c, and 1.5 million pressure cycles, with minimum rated pressure applied. ? tcspan: output deviation over the temperature range of 10 to 60 c, relative to 25 c. ? tcoffset: output deviation with minimum rated pressure applied, over the temperature range of 10 to 60 c, relative to 25 c. ? variation from nominal: the variation from nominal values, for offset or full scale span, as a percent of v fss , at 25 c. 5. auto zero at factory installation: due to the sensitivity of the mpxv5004g, external mechanical stresses and mounting positio n can affect the zero pressure output reading. autozeroing is defined as storing the zero pressure output reading and subtracting this from the device's output during normal operations. reference an1636 for specific information. the specified accuracy assumes a maximum temperatur e change of 5 c between autozero and measurement.
3181 motorola sensor device data www.motorola.com/semiconductors onchip temperature compensation, calibration and signal conditioning the performance over temperature is achieved by inte- grating the shearstress strain gauge, temperature com- pensation, calibration and signal conditioning circuitry onto a single monolithic chip. figure 2 illustrates the gauge configuration in the basic chip carrier (case 482). a fluorosilicone gel isolates the die surface and wire bonds from the environment, while allowing the pres- sure signal to be transmitted to the silicon diaphragm. the mpxv5004g series sensor operating characteristics are based on use of dry air as pressure media. media, other than dry air, may have adverse effects on sensor performance and longterm reliability. internal reliability and qualification test for dry air, and other media, are available from the factory. contact the factory for information regarding media tolerance in your application. figure 3 shows the recommended decoupling circuit for in- terfacing the output of the mpxv5004g to the a/d input of the microprocessor or microcontroller. proper decoupling of the power supply is recommended. figure 4 shows the sensor output signal relative to pres- sure input. typical, minimum and maximum output curves are shown for operation over a temperature range of 10 c to 60 c using the decoupling circuit shown in figure 3. the output will saturate outside of the specified pressure range. figure 2. crosssectional diagram (not to scale) 1.0 f ips 470 pf output vs 5 v 0.01 f gnd vout figure 3. recommended power supply decoupling and output filtering. for additional output filtering, please refer to application note an1646. fluorosilicone gel die coat wire bond differential sensing element thermoplastic case stainless steel cap lead frame p1 p2 die bond die figure 4. output versus pressure differential max differential pressure 5.0 4.0 3.0 2.0 output (v) transfer function: v out = v s *[(0.2*p) + 0.2] 1.5% v fss v s = 5.0 v 0.25 vdc temp = 10 to 60 c 1.0 min typical 2 kpa 200 mm h 2 o (see note 5 in operating characteristics) 4 kpa 400 mm h 2 o
3182 motorola sensor device data www.motorola.com/semiconductors pressure (p1)/vacuum (p2) side identification table motorola designates the two sides of the pressure sensor as the pressure (p1) side and the vacuum (p2) side. the pressure (p1) side is the side containing silicone gel which isolates the die from the environment. the motorola pressure sensor is designed to operate with positive differential pres- sure applied, p1 > p2. the pressure (p1) side may be identified by using the table below: part number case type pressure (p1) side identifier mpxv5004gc6u/t1 482a side with port attached mpxv5004g6u/t1 482 stainless steel cap mpxv5004gc7u 482c side with port attached mpxv5004g7u 482b stainless steel cap mpxv5004gp 1369 side with port attached mpxv5004dp 1351 side with port marking mpxv5004gvp 1368 stainless steel cap ordering information mpxv5004g series pressure sensors are available in the basic element package or with a pressure port. two packing options are offered for the surface mount configuration. device type / order no case no packing options device marking device type / order no . case no . packing options device marking mpxv5004g6u 482 rails mpxv5004g MPXV5004G6T1 482 tape and reel mpxv5004g mpxv5004gc6u 482a rails mpxv5004g mpxv5004gc6t1 482a tape and reel mpxv5004g mpxv5004gc7u 482c rails mpxv5004g mpxv5004g7u 482b rails mpxv5004g mpxv5004gp 1369 trays mpxv5004g mpxv5004dp 1351 trays mpxv5004g mpxv5004gvp 1368 trays mpxv5004g information for using the small outline package (case 482) minimum recommended footprint for surface mounted applications surface mount board layout is a critical portion of the total design. the footprint for the surface mount packages must be the correct size to ensure proper solder connection inter- face between the board and the package. with the correct fottprint, the packages will self align when subjected to a solder reflow process. it is always recommended to design boards with a solder mask layer to avoid bridging and short- ing between solder pads. 0.660 16.76 0.060 typ 8x 1.52 0.100 typ 8x 2.54 0.100 typ 8x 2.54 0.300 7.62 figure 5. sop footprint (case 482) inch mm scale 2:1
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